Laser Processing Machine for IC Substrates Market | Latest Analysis, Demand Trends, Growth Forecast

Laser Processing Machine for IC Substrates Demand Trends Linked to AI Packaging Capacity and ABF Substrate Expansion

Demand for laser drilling, laser direct structuring, micro-cutting, and precision ablation equipment used in IC substrate manufacturing accelerated noticeably during 2025 and continued into 2026 as advanced packaging utilization rates remained high across AI accelerators, HPC processors, and high-layer networking devices. The Laser Processing Machine for IC Substrates Market is estimated at approximately USD 1.86 billion in 2026, with Asia accounting for more than 78% of total equipment demand due to concentration of ABF substrate manufacturing and OSAT packaging operations. Procurement activity has been strongest for UV laser drilling systems used in high-density buildup substrates below 50 μm via diameters, where substrate makers are attempting to reduce warpage and improve layer registration accuracy for AI processors exceeding 3,000 I/O connections.

Machine utilization trends across substrate processing lines improved after the second half of 2024 when AI server shipments expanded sharply. Taiwan-based substrate manufacturers associated with NVIDIA AI accelerator supply chains increased capex allocations for laser via formation and substrate routing equipment as packaging complexity rose from 12–16 layer structures toward 20-layer and above configurations for high-bandwidth memory integration. In parallel, Japanese and Korean equipment vendors supplying UV nanosecond and picosecond laser platforms reported stronger backlog visibility from IC substrate producers expanding Ajinomoto Build-up Film (ABF) capacity.

Unlike conventional PCB processing, IC substrate fabrication requires tighter hole diameter tolerance, lower taper variation, and minimal thermal damage around buildup layers. This technical requirement has shifted equipment demand away from mechanical drilling in several advanced applications. Laser processing penetration in premium ABF substrate lines exceeded 72% during 2026 for microvia generation in leading-edge AI and server substrates, compared with below 55% adoption in 2021. Demand is also increasing from advanced automotive processors, especially zonal controllers and autonomous driving compute modules using large substrates with higher interconnect density.

Taiwan and South Korea Continue to Dominate Laser Processing Machine for IC Substrates Market Procurement

Taiwan remains the single largest demand center for laser processing systems used in IC substrate manufacturing. The country controls a substantial share of global ABF substrate output through manufacturers including Unimicron, Nan Ya PCB, Kinsus Interconnect Technology, and Ibiden Taiwan operations. During March 2025, multiple Taiwanese substrate suppliers expanded production lines dedicated to AI GPU substrates after hyperscale server demand exceeded initial projections tied to generative AI infrastructure deployment.

The impact on the Laser Processing Machine for IC Substrates Market has been immediate. UV laser drilling systems with higher pulse stability and automated alignment capabilities saw stronger ordering activity because AI substrates increasingly require stacked microvia structures with reduced positional deviation. Taiwan’s Ministry of Economic Affairs highlighted semiconductor packaging and substrate manufacturing among priority industrial segments under advanced manufacturing investment programs, supporting continued equipment imports through 2026.

South Korea is also contributing materially to demand growth, particularly through Samsung Electro-Mechanics and Daeduck Electronics. High-layer substrate adoption for AI memory modules and advanced automotive processors has increased laser machining intensity per panel. Korean manufacturers are emphasizing finer line spacing and thinner dielectric materials, both of which raise dependency on non-contact laser processing. In January 2026, Korean semiconductor packaging investments tied to AI server infrastructure surpassed KRW 8 trillion across substrate and advanced packaging facilities, indirectly supporting procurement of high-precision laser drilling and singulation systems.

Demand patterns in South Korea differ slightly from Taiwan because Korean suppliers maintain stronger exposure to memory packaging ecosystems. This creates additional requirements for laser trimming and substrate edge processing technologies used in high-throughput HBM packaging lines. Equipment suppliers with expertise in thermal damage reduction are benefiting as substrate thickness continues to decrease in advanced memory integration platforms.

China Expands Domestic Supply Chain Capability Despite Technology Dependence

China represents the fastest-growing regional demand source in unit shipments for the Laser Processing Machine for IC Substrates Market, although technological dependence on Japanese and European laser subsystems remains significant. Domestic IC substrate manufacturing expansion accelerated after 2024 as import substitution programs intensified across semiconductor materials and packaging.

Shennan Circuits, Fastprint, ACCESS, and several state-supported packaging projects expanded substrate production capabilities between 2024 and 2026, particularly for FC-BGA and FC-CSP applications. Guangdong, Jiangsu, and Sichuan provinces collectively announced semiconductor packaging and substrate investments exceeding RMB 140 billion during this period. A substantial portion of these facilities require laser drilling systems because advanced package substrates increasingly incorporate ultra-small blind vias and thin dielectric layers unsuitable for conventional mechanical processing.

Chinese equipment localization has improved in lower-end PCB laser processing systems, but advanced IC substrate applications still rely heavily on Japanese UV laser source technology and imported galvanometer systems. As a result, procurement demand continues to favor suppliers capable of providing stable short-pulse laser processing with low carbonization and high throughput consistency.

Another important demand driver comes from automotive electronics. China accounted for more than 35% of global electric vehicle production during 2025, increasing semiconductor packaging requirements for power management ICs, ADAS modules, and centralized computing architectures. These systems require more advanced substrates with tighter interconnect density, supporting higher laser processing intensity per production panel.

Japan Maintains Technology Leadership in Precision Laser Systems for Substrate Manufacturing

Japan’s role in the Laser Processing Machine for IC Substrates Market is more concentrated on technology leadership than manufacturing volume expansion. Japanese firms continue to dominate critical laser components, UV laser sources, beam shaping optics, and ultra-precision motion systems used in advanced substrate processing.

Companies such as Mitsubishi Electric, SCREEN Holdings, Hitachi Via Mechanics, and Canon Machinery remain central suppliers to substrate manufacturing ecosystems across Asia. Japanese equipment suppliers gained stronger demand traction during 2025 after substrate makers increased investment in low thermal impact laser processing for ultra-thin ABF layers.

The Japanese market itself remains important because domestic substrate manufacturers including Ibiden and Shinko Electric are increasing capacity for AI accelerator packaging. In September 2025, additional substrate line expansions linked to AI processors and advanced data-center networking devices were announced in Gifu and Nagano prefectures. These facilities require advanced laser via drilling systems capable of handling extremely high aspect ratio microvias while maintaining tight positional accuracy.

Japan also benefits from rising demand for glass core substrate research and advanced packaging experimentation. Pilot manufacturing programs involving next-generation substrate architectures are increasing procurement of picosecond and femtosecond laser systems designed for ultra-clean material removal and reduced heat affected zones.

Southeast Asia Emerging as Secondary Manufacturing Base for IC Substrate Processing

Southeast Asia is becoming increasingly relevant in the Laser Processing Machine for IC Substrates Market as multinational electronics firms diversify supply chains beyond North Asia. Malaysia, Vietnam, and Thailand are attracting packaging and substrate-related investments tied to geopolitical risk diversification and electronics export growth.

Malaysia strengthened its semiconductor backend manufacturing position during 2025 with additional OSAT and substrate-related investments around Penang and Kulim. Demand for substrate laser processing equipment in the country is tied less to leading-edge AI substrates and more toward automotive, industrial, and networking semiconductor packages. Even so, substrate complexity is increasing steadily, particularly for automotive radar and power electronics applications.

Vietnam has seen stronger PCB and substrate ecosystem migration from Chinese and Taiwanese suppliers. While advanced ABF substrate manufacturing remains limited, investments in HDI and semiconductor packaging infrastructure are gradually creating demand for mid-range UV laser drilling systems. Thailand’s automotive semiconductor push is also supporting localized demand for substrate manufacturing technologies connected to EV electronics and smart mobility modules.

North America and Europe Drive Technology Demand Through Advanced Packaging Investments

North America represents a smaller share of global manufacturing volume but remains important from a technology consumption perspective. The U.S. CHIPS-related investments announced between 2024 and 2026 increased advanced packaging capacity planning, particularly in Arizona and Texas. As domestic substrate ecosystems expand gradually, demand for precision laser processing equipment is rising within pilot lines and advanced packaging facilities.

AI infrastructure investment is a major indirect catalyst. During 2025, hyperscale data center spending in the United States exceeded USD 300 billion, driving demand for AI accelerators requiring high-density IC substrates. Although much of the substrate manufacturing remains Asia-based, North American packaging programs are increasing equipment procurement for R&D and specialty production.

Europe’s demand profile is more concentrated around automotive and industrial semiconductor packaging. Germany and Austria continue investing in advanced power semiconductor packaging and automotive electronics manufacturing. This supports moderate demand growth for laser substrate processing systems used in ceramic and organic substrate applications tied to automotive control systems and industrial automation hardware.

The Laser Processing Machine for IC Substrates Market therefore remains closely tied to geographic concentration of semiconductor packaging ecosystems, AI server deployment rates, and substrate complexity migration. Countries expanding advanced packaging infrastructure continue to generate the strongest equipment demand, while regions focused mainly on mature-node electronics exhibit slower procurement growth and lower technology intensity.

Laser Processing Machine for IC Substrates Demand Trends Supported by AI Accelerator Packaging and High-Layer ABF Production

Global procurement of laser drilling and laser structuring systems used for IC substrate manufacturing increased sharply between late 2024 and 2026 as advanced semiconductor packaging capacity tightened across AI, HPC, and networking applications. The Laser Processing Machine for IC Substrates Market is estimated to reach nearly USD 1.9 billion in 2026, with UV laser systems accounting for more than 58% of equipment revenue because of their higher adoption in fine-pitch ABF substrate processing. Demand intensity has risen particularly in substrate facilities producing FC-BGA platforms for AI GPUs and high-bandwidth memory integration, where microvia density per panel is substantially higher than conventional server or consumer electronics substrates.

Production metrics from semiconductor packaging ecosystems indicate why equipment spending accelerated. AI server shipments are projected to expand by over 33% during 2026, while advanced package substrate area consumption per AI accelerator package remains several times higher than standard CPU packages. This is increasing the number of laser drilling cycles required per substrate panel. In Taiwan and South Korea, leading substrate manufacturers shifted portions of their 2025–2026 capex budgets from mechanical drilling systems toward UV and picosecond laser platforms capable of handling via diameters below 40 μm with lower thermal deformation.

Demand has not been uniform across all applications. Consumer electronics-related substrate investments remain uneven because smartphone shipment recovery has been moderate outside premium AI-enabled devices. In contrast, AI data-center infrastructure, automotive domain controllers, and advanced networking switches continue generating strong orders for high-layer substrates, directly supporting procurement of laser processing systems used for microvia formation, laser routing, laser trimming, and precision substrate singulation.

Taiwan Leads Procurement Volumes in the Laser Processing Machine for IC Substrates Market

Taiwan continues to account for the largest concentration of demand in the Laser Processing Machine for IC Substrates Market because of its dominance in ABF substrate manufacturing and advanced packaging integration. Companies including Unimicron, Nan Ya PCB, Kinsus, and AT&S Taiwan operations expanded advanced substrate production during 2025 to support AI accelerator and high-performance computing demand linked to NVIDIA, AMD, and custom ASIC programs.

The Industrial Technology Research Institute (ITRI) in Taiwan noted during early 2026 that AI-related semiconductor packaging workloads were increasing substrate layer counts and reducing acceptable defect tolerance levels. This has increased the transition toward laser-based non-contact drilling systems, especially in buildup layers where conventional mechanical drilling introduces higher risk of material cracking and registration loss.

In April 2025, Unimicron expanded substrate manufacturing capacity dedicated to AI accelerators and advanced networking processors, adding additional high-density buildup lines in Taoyuan. Such expansions materially affect laser equipment demand because advanced FC-BGA substrates require significantly more laser-drilled blind vias than mainstream notebook or smartphone packages. Taiwanese equipment procurement also favors automation-integrated laser platforms capable of inline inspection and alignment correction, reducing yield loss in high-value AI packaging substrates.

Taiwan’s demand profile differs from broader PCB markets. While standard PCB capital expenditure slowed after inventory correction cycles in consumer electronics, IC substrate investments continued because AI processor substrate requirements remained supply constrained. As a result, laser system suppliers focused on substrate applications maintained stronger backlog stability than vendors dependent mainly on conventional PCB customers.

South Korea Expands High-End Packaging Lines for AI Memory and Automotive Electronics

South Korea remains one of the most technically advanced markets for laser processing systems used in IC substrate manufacturing. Samsung Electro-Mechanics and Daeduck Electronics increased investment in ultra-high multilayer substrates during 2025 as HBM packaging and AI memory demand strengthened. The country’s substrate ecosystem is closely tied to memory packaging, which changes equipment demand patterns compared with Taiwan.

HBM integration requires tighter substrate tolerances and more precise interconnect structures, increasing dependence on short-pulse UV laser processing. Korean manufacturers are also moving toward thinner substrate architectures to improve package thermal efficiency and signal performance. These thinner materials are more sensitive to thermal damage during drilling and routing operations, pushing adoption of picosecond laser technologies.

In February 2026, South Korea announced additional semiconductor support measures tied to AI supply chain competitiveness, including infrastructure and financing support for packaging and substrate manufacturing. Total announced investments linked to advanced semiconductor packaging and substrate production exceeded KRW 9 trillion during the 2025–2026 period. This is directly supporting orders for laser via drilling and substrate cutting systems across new manufacturing lines.

Automotive electronics is another important contributor. South Korea’s automotive semiconductor ecosystem is increasing usage of advanced processors for EV platforms and ADAS modules. These devices require more complex substrates with finer circuitry, supporting higher laser machining intensity per production cycle.

China’s Domestic Expansion Supports Equipment Shipments but Pricing Pressure Remains High

China is generating the fastest growth in installed unit volume for laser substrate processing equipment, although average selling prices remain below Japanese and European premium systems. The country accelerated investments in semiconductor packaging and substrate localization after 2024, particularly in Guangdong, Jiangsu, and Anhui provinces.

Several Chinese substrate suppliers increased FC-BGA and FC-CSP production capability during 2025 to reduce reliance on imported packaging substrates. The China Semiconductor Industry Association highlighted advanced packaging and substrate manufacturing as strategic priorities because AI processors, automotive chips, and industrial controllers increasingly require high-density packaging architectures.

This expansion directly benefits suppliers of UV laser drilling systems, laser ablation platforms, and precision cutting equipment. However, competition is intensifying. Domestic Chinese laser equipment makers have improved capabilities in mid-range systems used for HDI and lower-complexity substrate applications, creating pricing pressure for foreign vendors in non-premium segments.

At the same time, advanced AI-related substrate production still relies heavily on imported laser technologies. Japanese UV laser sources and European beam delivery systems continue to dominate high-end installations because advanced FC-BGA substrates require extremely low carbon residue and high drilling consistency. Chinese manufacturers targeting AI accelerator packaging therefore continue purchasing imported high-precision systems despite broader localization efforts.

Demand growth from electric vehicles is particularly influential. China produced more than 13 million electric vehicles during 2025, creating additional packaging demand for power management ICs, silicon carbide modules, and centralized computing processors. These semiconductor packages increasingly require substrate designs unsuitable for older mechanical drilling methods.

Japan Maintains Technology Control in Precision Laser Processing Systems

Japan’s position in the Laser Processing Machine for IC Substrates Market is shaped more by technological leadership than manufacturing scale expansion. Japanese suppliers remain dominant in UV laser sources, precision optics, motion control systems, and advanced drilling platforms used in premium IC substrate fabrication.

Mitsubishi Electric, Hitachi Via Mechanics, SCREEN Holdings, and Canon Machinery continue supplying advanced laser systems to substrate manufacturers across Asia. Japanese substrate producers including Ibiden and Shinko Electric also expanded AI-related substrate capacity during 2025 as demand for advanced processors increased.

One major shift in Japan involves experimentation with next-generation substrate materials and glass core technologies. Pilot projects connected to advanced packaging research are increasing procurement of femtosecond laser systems because these technologies offer cleaner material removal and reduced heat-affected zones compared with traditional nanosecond systems.

Japan’s equipment demand is therefore less volume-driven and more technology-intensive. Customers prioritize drilling accuracy, beam stability, and substrate warpage reduction over simple throughput metrics. This favors suppliers capable of delivering integrated process optimization instead of standalone laser hardware.

Southeast Asia Gains Importance as Packaging Diversification Accelerates

Malaysia, Vietnam, and Thailand are gradually becoming secondary demand centers for IC substrate laser processing systems as electronics supply chains diversify geographically. Growth remains uneven because the region still lacks large-scale leading-edge ABF substrate ecosystems comparable to Taiwan or South Korea.

Malaysia has strengthened its position in semiconductor backend operations, particularly around Penang and Kulim. During 2025, multiple packaging and electronics manufacturing investments were announced for automotive electronics and industrial semiconductor applications. This is increasing demand for mid-range laser drilling systems used in substrate and HDI manufacturing.

Vietnam is attracting PCB and electronics assembly migration from China, but advanced substrate processing remains limited. Even so, investment in semiconductor packaging infrastructure is increasing demand for UV laser processing systems capable of supporting finer interconnect structures.

Thailand’s demand is tied mainly to automotive electronics. EV manufacturing expansion and smart mobility programs are supporting procurement of substrate manufacturing technologies connected to automotive processors and radar systems. However, demand growth is expected to remain moderate compared with North Asia because local substrate manufacturing capacity is still relatively small.

North America and Europe Focus on Strategic Packaging Capability Rather Than Large-Scale Volume

The United States and parts of Europe are increasing investments in semiconductor packaging resilience, but their impact on global substrate equipment volume remains smaller than Asia’s contribution. The U.S. CHIPS-related initiatives announced between 2024 and 2026 encouraged development of domestic advanced packaging capacity, especially in Arizona and Texas.

Demand for laser substrate processing systems in North America is concentrated around pilot manufacturing, defense electronics, and advanced AI packaging development rather than large-scale commodity substrate production. AI infrastructure expansion remains a major indirect driver. Hyperscale data-center investments in the United States exceeded USD 320 billion during 2025, increasing demand for advanced processors that consume large, high-density IC substrates manufactured primarily in Asia.

Europe’s contribution is linked mainly to automotive and industrial semiconductors. Germany and Austria continue investing in power electronics packaging and automotive semiconductor production, supporting steady but slower demand growth for laser drilling and substrate structuring systems. Growth rates in Europe remain below Asia because the region lacks large-scale ABF substrate manufacturing concentration.

Competitive Landscape and Manufacturer Positioning in the Laser Processing Machine for IC Substrates Market

The Laser Processing Machine for IC Substrates Market remains highly specialized, with a limited number of equipment suppliers capable of meeting the precision and throughput requirements associated with advanced semiconductor packaging substrates. The market is dominated by Japanese manufacturers in high-end systems, while Chinese suppliers are gaining traction in mid-range and domestic applications. Taiwanese and Korean equipment ecosystems also play an important role through integration, automation, and localized process engineering support.

Premium equipment demand is concentrated in applications involving FC-BGA substrates, AI accelerators, high-bandwidth memory integration, networking ASICs, and automotive processors. These applications require ultra-fine microvia drilling, low thermal damage, high positional accuracy, and stable laser beam control. As a result, leading IC substrate manufacturers generally prefer suppliers with proven process stability and long qualification histories.

Japanese suppliers collectively account for nearly half of global revenue generation in the Laser Processing Machine for IC Substrates Market during 2026. Their leadership is supported by strength in ultraviolet laser sources, optical systems, beam delivery technology, and high-speed precision motion control platforms.

Hitachi Via Mechanics remains one of the strongest suppliers in advanced substrate laser drilling systems. The company has established a major installed base across Taiwan, Japan, and South Korea, particularly among manufacturers producing ABF substrates for AI and HPC processors. Its product lineup includes the LU series ultraviolet laser drilling systems and LC series CO₂ laser platforms designed for FC-BGA substrates, HDI applications, automotive multilayer boards, and semiconductor package substrates.

The company’s ultraviolet laser systems are widely adopted for fine microvia processing because AI-oriented package substrates increasingly require smaller via diameters and higher layer counts. Demand for these systems strengthened considerably during 2025 as substrate manufacturers expanded production lines for AI GPUs and high-performance server processors. The company also benefits from growing investment in semi-additive processing technologies where finer line spacing increases the need for precise laser alignment and controlled drilling quality.

Mitsubishi Electric continues to maintain a strong position in high-precision laser processing technologies used in semiconductor substrate fabrication. The company manufactures key laser system components internally, including oscillators, optical systems, galvano scanners, and control units. This vertical integration supports stable performance in high-volume manufacturing environments where substrate yields are critically important.

Its laser drilling systems are increasingly used in advanced buildup substrate processing for automotive electronics, AI packaging, and memory-related semiconductor applications. The shift toward thinner dielectric materials and finer interconnect density is increasing demand for systems capable of minimizing substrate deformation and carbon residue during drilling operations. Mitsubishi Electric has also focused on automated process control and inline optimization technologies, which are becoming more important as substrate manufacturers attempt to improve throughput without sacrificing yield.

SCREEN Holdings remains influential in laser direct imaging and substrate patterning technologies connected to semiconductor packaging manufacturing. The company’s systems are widely used in advanced substrate fabrication where photomask-free exposure and high alignment precision are necessary for fine-line circuit formation.

As semiconductor package substrates become more complex, direct imaging technologies are gaining importance in both redistribution layer processing and substrate patterning applications. SCREEN has benefited from rising demand for high-density AI packaging where fine circuitry and multilayer buildup structures require increasingly accurate imaging capability. Its recent equipment developments have focused on distortion correction and high-speed alignment optimization for semiconductor packaging environments.

KLA, through its Orbotech business, maintains a strong position in direct imaging, inspection, and process control systems associated with IC substrate manufacturing. The company benefits from its deep presence in semiconductor yield management and inspection technologies. Advanced substrate manufacturers increasingly require integrated process monitoring because substrate defect costs have risen sharply in AI accelerator packaging.

KLA’s systems are particularly relevant in production lines manufacturing premium FC-BGA substrates for AI processors and high-speed networking chips. Yield loss in these applications carries significantly higher financial impact compared with conventional consumer electronics substrates, increasing demand for advanced inspection and imaging systems integrated with laser processing operations.

Chinese suppliers are becoming more visible in the Laser Processing Machine for IC Substrates Market, especially in domestic semiconductor manufacturing projects supported by localization initiatives. Han’s Laser Technology remains the most recognized Chinese participant in laser drilling and substrate processing equipment.

The company has expanded its presence in HDI board manufacturing, IC substrate drilling, and precision electronics processing applications. Demand for domestic Chinese equipment increased during 2025 and 2026 as regional semiconductor packaging projects accelerated across Guangdong, Jiangsu, and Anhui provinces. However, advanced AI substrate production still relies heavily on imported ultraviolet laser technologies because high-end FC-BGA manufacturing requires superior drilling stability, tighter taper control, and reduced thermal damage.

HG Laser is another Chinese supplier increasing participation in electronics laser processing applications. The company’s equipment is used more widely in mid-range substrate and PCB manufacturing environments rather than the most advanced AI substrate production lines. Chinese suppliers remain highly competitive on pricing, which has increased pressure on foreign vendors in standard HDI and conventional package substrate applications.

The competitive structure of the Laser Processing Machine for IC Substrates Market remains relatively concentrated because customer qualification cycles are long and technically demanding. Leading substrate manufacturers often require more than one year of process evaluation before approving new laser systems for mass production. Once qualified, equipment suppliers generally maintain long-term relationships with customers because production process changes carry substantial yield risk.

Taiwanese substrate manufacturers remain the largest customer group for premium laser drilling systems due to their dominance in AI-related ABF substrate production. Companies such as Unimicron, Nan Ya PCB, and Kinsus continue expanding manufacturing lines tied to AI server and accelerator demand. South Korean customers are more focused on memory packaging and automotive semiconductor applications, while Chinese demand growth is increasingly linked to domestic semiconductor supply chain development.

Competition in the market is gradually shifting from pure drilling speed toward integrated process capability. Customers increasingly prioritize beam stability, thermal management, automation compatibility, inline inspection integration, and substrate warpage reduction. This trend favors suppliers capable of delivering complete process solutions rather than standalone laser hardware.

Recent developments across the industry continue reflecting the close connection between advanced semiconductor packaging investment and laser equipment demand.

In April 2025, Amada strengthened its electronics manufacturing technology portfolio through activities involving Via Mechanics and advanced PCB drilling technologies. The move reflected growing interest in semiconductor packaging-related manufacturing systems as AI infrastructure investment accelerated globally.

During 2025, multiple substrate manufacturers in Taiwan expanded FC-BGA substrate capacity dedicated to AI accelerators and high-performance computing processors. These projects increased procurement activity for ultraviolet laser drilling systems and direct imaging equipment.

Japanese equipment suppliers also accelerated development work on laser technologies for glass core substrates and next-generation semiconductor packaging structures. Pilot production activities involving glass substrate processing increased demand for femtosecond and picosecond laser systems capable of achieving lower thermal impact during material removal.

In South Korea, additional semiconductor packaging investments announced during early 2026 supported expansion of advanced substrate manufacturing lines associated with high-bandwidth memory and AI processors. These projects are expected to sustain strong demand for laser drilling and substrate structuring systems over the next several years.